We found a match
Your institution may have access to this item. Find your institution then sign in to continue.
- Title
High-Speed Signal Optimization at Differential VIAs in Multilayer Printed Circuit Boards.
- Authors
Xu, Wen-Jie; Xin, Dong-Jin; Yang, Lei; Zhou, Yong-Kang; Wang, Dong; Li, Wei-Xin
- Abstract
The number of Printed Circuit Board (PCB) layers is continually increasing with the increase in data transmission rates, and the Signal Integrity (SI) of high-speed digital systems cannot be ignored. Introducing Vertical Interconnect Accesses (VIAs) in PCBs can realize the electrical connection between the top layer and the inner layers, however, VIAs represent one of the most important reasons for discontinuity between the PCBs and package. In this paper, a new optimization scheme for a differential VIA stub is proposed, with 3D full-wave numerical simulation used for modeling and simulation. Results show that this scheme optimizes the return loss and insertion loss while making the signal eye diagram more ideal, which can improve the transmission effect of high-speed signals.
- Publication
Electronics (2079-9292), 2024, Vol 13, Issue 17, p3377
- ISSN
2079-9292
- Publication type
Article
- DOI
10.3390/electronics13173377