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- Title
A Synchrotron Radiation X-Ray Microdiffraction Study on Orientation Relationships between a Cu<sub>6</sub>Sn<sub>5</sub> and Cu Substrate in Solder Joints.
- Authors
Suh, J.O.; Tu, K. N.; Tamura, N.
- Abstract
The orientation distribution of Cu6Sn5 scallops and its relationship with the orientation of copper substrate was studied using synchrotron-radiation-based micro-x-ray diffraction. Laue spots were obtained both from the Cu6Sn5 and copper were obtained. The orientation of the Cu6Sn5 scallops had a strong dependence on that copper. The [001] direction of Cu6Sn5 is always parallel to the [110] of copper, and either the (110) or the (010) plane of Cu6Sn5 is parallel to the (001) plane of copper. It was also found that the scallops of Cu6Sn5 gradually gain texture in the early stage of reflow, but lose the texture after a long reflow.
- Subjects
SYNCHROTRONS; PARTICLE accelerators; X-rays; COPPER; NUCLEAR physics instruments
- Publication
JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2006, Vol 58, Issue 6, p63
- ISSN
1047-4838
- Publication type
Article
- DOI
10.1007/s11837-006-0185-7