Found: 31
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Effects of Trace Elements Ag, Bi and Ni on Solid–Liquid Electromigration Interface Diffusion in Solder Joints.
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- Journal of Electronic Materials, 2021, v. 50, n. 9, p. 5312, doi. 10.1007/s11664-021-08942-4
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Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging.
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- Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1758, doi. 10.1007/s11664-018-06865-1
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- Article
Effects of Micro Solder Joint Geometry on Interfacial IMC Growth Rate.
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- Journal of Electronic Materials, 2017, v. 46, n. 7, p. 4034, doi. 10.1007/s11664-017-5344-9
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Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2450, doi. 10.1007/s11664-015-3774-9
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Multi-particle molecular dynamics simulation: shell thickness effects on sintering process of Cu-Ag core-shell nanoparticles.
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- Journal of Nanoparticle Research, 2021, v. 23, n. 1, p. 1, doi. 10.1007/s11051-021-05144-1
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- Article
Effect of porous Cu addition on the microstructure and mechanical properties of SnBi-xAg solder joints.
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- Applied Physics A: Materials Science & Processing, 2020, v. 126, n. 9, p. N.PAG, doi. 10.1007/s00339-020-03926-3
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Mechanical Response of Cu/Sn58Bi-xNi/Cu Micro Solder Joint with High Temperatures.
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- Crystals (2073-4352), 2024, v. 14, n. 3, p. 269, doi. 10.3390/cryst14030269
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Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging.
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- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 33, p. 25025, doi. 10.1007/s10854-022-09210-9
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Microstructure, mechanical, and thermal behaviors of SnBi/Cu solder joint enhanced by porous Cu.
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- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 11, p. 8258, doi. 10.1007/s10854-020-03361-3
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The interfacial Cu–Sn intermetallic compounds (IMCs) growth behavior of Cu/Sn/Cu sandwich structure via induction heating method.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18878, doi. 10.1007/s10854-019-02244-6
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- Article
Shear strength, fracture mechanism and plastic performance of Cu/Sn5Sb–xCuNiAg/Cu solder joints during thermal aging.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18342, doi. 10.1007/s10854-019-02188-x
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- Article
Microstructure and mechanical properties of nano-Ag sintered joint enhanced by Cu foam.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 16, p. 15795, doi. 10.1007/s10854-019-01965-y
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- Article
Microstructure and shear behavior of solder joint with Sn58Bi/Sn3.0Ag0.5Cu/Cu superposition structure.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 14077, doi. 10.1007/s10854-019-01773-4
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- Article
The effect of temperature gradient on interfacial Cu<sub>6</sub>Sn<sub>5</sub> growth during thermal compression bonding.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 13957, doi. 10.1007/s10854-019-01741-y
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Solder interconnects reliability subjected to thermal-vibration coupling loading.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11482, doi. 10.1007/s10854-019-01501-y
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- Article
The fast formation of full Cu<sub>3</sub>Sn solder joints in Cu/Sn/Cu system by thermal gradient bonding.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 3, p. 2146, doi. 10.1007/s10854-018-0486-y
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- Article
Thermal and mechanical properties of micro Cu doped Sn58Bi solder paste for attaching LED lamps.
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- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 1, p. 340, doi. 10.1007/s10854-018-0298-0
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Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates.
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- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 15, p. 13167, doi. 10.1007/s10854-018-9440-2
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Microstructure, hardness, and shear behavior of the as-soldered SnBi-SAC composite solder pastes.
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- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 24, p. 19113, doi. 10.1007/s10854-017-7866-6
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Solderability of SnBi-nano Cu solder pastes and microstructure of the solder joints.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 3, p. 2235, doi. 10.1007/s10854-015-4016-x
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Failure study of solder joints subjected to random vibration loading at different temperatures.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 4, p. 2374, doi. 10.1007/s10854-015-2693-0
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- Article
Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 11, p. 4954, doi. 10.1007/s10854-014-2257-8
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Geometrical size effect on the interface diffusion of micro solder joint in electro-thermal coupling aging.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 9, p. 3742, doi. 10.1007/s10854-014-2084-y
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- Article
Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC-Bi-Ni/Cu solder joints.
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- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 6, p. 2627, doi. 10.1007/s10854-014-1921-3
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- Article
Characterization of interfacial IMCs in low-Ag Sn-Ag-xCu-Bi-Ni solder joints.
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- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 1, p. 290, doi. 10.1007/s10854-012-0741-6
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Solderability, IMC evolution, and shear behavior of low-Ag Sn0.7Ag0.5Cu-BiNi/Cu solder joint.
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- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 9, p. 1705, doi. 10.1007/s10854-012-0649-1
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Study of surface quality in machining nickel-based alloy Inconel 718.
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- International Journal of Advanced Manufacturing Technology, 2013, v. 69, n. 9-12, p. 2659, doi. 10.1007/s00170-013-5225-1
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- Article
Microstructure and shear behavior of Sn58Bi/Cu solder joint enhanced by SnAgCuBiNi bump.
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- Modern Physics Letters B, 2020, v. 34, n. 36, p. N.PAG, doi. 10.1142/S0217984920504138
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Interfacial reaction, microstructure and hardness between graphene-coated Cu substrate and SAC305 solder doped with minor Ni during isothermal aging.
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- Modern Physics Letters B, 2019, v. 33, n. 6, p. N.PAG, doi. 10.1142/S021798491950060X
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Effect of Ni concentration on solderability, microstructure and hardness of SAC0705-xNi solder joints on Cu and graphene-coated Cu substrates.
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- Modern Physics Letters B, 2019, v. 33, n. 1, p. N.PAG, doi. 10.1142/S0217984918504250
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Formation mechanism of Cu/Cu<sub>3</sub>Sn–Cu/Cu interconnections based on solder-filled microporous copper as interlayer via a current-assisted thermal compression bonding.
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- Modern Physics Letters B, 2021, v. 35, n. 20, p. N.PAG, doi. 10.1142/S021798492150322X
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- Article