Back to matchesWe found a matchYour institution may have access to this item. Find your institution then sign in to continue.TitleUpcycling Chips‐Bags for Passive Daytime Cooling (Adv. Mater. Technol. 18/2023).AuthorsSong, Qimeng; Tran, Thomas; Herrmann, Kai; Schmalz, Holger; Retsch, MarkusPublicationAdvanced Materials Technologies, 2023, Vol 8, Issue 18, p1ISSN2365-709XPublication typeArticleDOI10.1002/admt.202370095