We found a match
Your institution may have access to this item. Find your institution then sign in to continue.
- Title
Interfacial Reactions and Joint Strengths of Sn- xZn Solders with Immersion Ag UBM.
- Authors
Jee, Y. k.; Jin Yu
- Abstract
The solder joint microstructures of immersion Ag with Sn- xZn ( x = 0 wt.%, 1 wt.%, 5 wt.%, and 9 wt.%) solders were analyzed and correlated with their drop impact reliability. Addition of 1 wt.% Zn to Sn did not change the interface microstructure and was only marginally effective. In comparison, the addition of 5 wt.% or 9 wt.% Zn formed layers of AgZn/AgZn at the solder joint interface, which increased drop reliability significantly. Under extensive aging, Ag-Zn intermetallic compounds (IMCs) transformed into CuZn and AgSn, and the drop impact resistance at the solder joints deteriorated up to a point. The beneficial role of Zn on immersion Ag pads was ascribed to the formation of Ag-Zn IMC layers, which were fairly resistant to the drop impact, and to the suppression of the brittle CuSn phase at the joint interface.
- Subjects
SOLDER &; soldering; REFRACTOMETRY; INTERMETALLIC compounds; MICROSTRUCTURE; ELECTRIC properties; COPPER; ELECTRIC properties of zinc
- Publication
Journal of Electronic Materials, 2010, Vol 39, Issue 10, p2286
- ISSN
0361-5235
- Publication type
Article
- DOI
10.1007/s11664-010-1308-z