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- Title
FACTORS RELATED TO SUICIDAL IDEATION AMONG ADOLESCENTS IN HONG KONG.
- Authors
Siu-Man Ng; Mao-Sheng Ran; Chan, Cecilia Lai-Wan
- Abstract
The study investigated the relations among suicidal ideation, general mental health status (domains: depression, lack of confidence and uselessness; measured by the shorter General Health Questionnaire [GHQ]), and psycho- social difficulties and strengths with 2638 secondary school students in Hong Kong. A cross-sectional survey using self-report questionnaires was carried out. Suicidal ideation was assessed by four relevant items on GHQ. Overall prevalence of suicidal ideation was revealed to be 14.6%, with 1.9% at severe level. Binary logistic regression indicated that factors associated with increased level of suicidal ideation were being female, lack of confidence, conduct disorder, and emotional symptoms. Factors associated with lowered level of suicidal ideation were spirituality, tranquility, resilience, and being in senior grades. The prevalence of suicidal ideation revealed in this study is lower than findings of other local studies which included non- school participants. This seems to confirm the overemphasis of academic achievements in Chinese culture. Similar to Western studies, being female appeared to be a risk factor in the current study, but showed a relatively lower odds ratio (1.67, versus over .2 in Western studies). Suicidal ideation among male Chinese adolescents appeared to be more prevalent than we used to believe. Apart from addressing risk factors and psychopathology, the findings of the current study point to the desirability of also addressing the spiritual and meaning domains in suicide prevention.
- Subjects
HONG Kong (China); ANALYSIS of variance; CHI-squared test; EPIDEMIOLOGY; PROBABILITY theory; PATHOLOGICAL psychology; SURVEYS; LOGISTIC regression analysis; DATA analysis; SUICIDAL ideation; CROSS-sectional method
- Publication
Illness, Crisis & Loss, 2010, Vol 18, Issue 4, p341
- ISSN
1054-1373
- Publication type
Journal Article
- DOI
10.2190/IL.18.4.d