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- Title
Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC-Bi-Ni/Cu solder joints.
- Authors
Liu, Yang; Sun, Fenglian; Li, Xuemei
- Abstract
This paper investigated the effect of Bi, Ni concentration on the microstructure and interfacial intermetallic compounds of low-Ag Sn-0.7Ag-0.5Cu-xBi-yNi/Cu solder joints by comparing with Sn-0.7Ag-0.5Cu (SAC0705)/Cu and Sn-3Ag-0.5Cu (SAC305)/Cu. Meanwhile, the shear behavior of the solder joints at both the bulk solder and soldering interface with various Bi, Ni content were also studied. Experimental results indicated that SAC0705-3.5Bi showed coarse microstructure due to the excessive growth of β-Sn dendritic crystal, which can be obviously suppressed by small amount of Ni element addition. Needle-like (Cu, Ni)Sn appeared in the bulk solder of SAC-Bi-Ni/Cu, instead of the pipe-like CuSn in SAC/Cu. Compare with SAC0705/Cu and SAC305/Cu, SAC-Bi-Ni/Cu showed higher shear strength at both the bulk solder and soldering interface. The increase of Bi content significantly increased the shear strength of Sn-0.7Ag-0.5Cu-xBi-yNi/Cu solder joints at the soldering interface. Brittle fracture appeared in the bulk solder of Sn-0.7Ag-0.5Cu-3.5Bi-0.05Ni/Cu solder joint. But this brittle failure can be suppressed by increasing the concentration of Ni in the solder alloys.
- Subjects
MICROSTRUCTURE; SOLDER joints; NICKEL; BISMUTH; INTERMETALLIC compounds; DENDRITIC crystals; SHEAR strength; SILVER
- Publication
Journal of Materials Science: Materials in Electronics, 2014, Vol 25, Issue 6, p2627
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-014-1921-3