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- Title
Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures.
- Authors
Zhang, X.; Yu, C.; Shrestha, S.; Dorn, L.
- Abstract
Creep and fatigue behaviors of the interconnections soldered by the lead-free Sn–Ag–Cu–Bi solder were investigated at different elevated temperatures (with the homologue temperature in the range of 0.71– 0.82), with a comparison to that of a traditional Sn60Pb40 solder. The results show that the lead-free Sn–Ag–Cu–Bi solder shows a superior anti-creep performance over the Sn60Pb40 solder, in terms of a much lower creep strain rate and a vastly elongated creep fracture lifetime; in the secondary creep regime, the calculated creep-activation energy for two solders is reasonably close to other published data. In addition, it has also been shown that the joints soldered by the lead-free Sn–Ag–Cu–Bi solder exhibits a superb fatigue property.
- Subjects
LEAD; PROPERTIES of matter; TEMPERATURE; OPTOELECTRONICS; ELECTRONICS
- Publication
Journal of Materials Science: Materials in Electronics, 2007, Vol 18, Issue 6, p665
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-006-9078-3