Back to matchesWe found a matchYour institution may have access to this item. Find your institution then sign in to continue.TitleEffects on the microstructure and mechanical properties of Sn-0.7Cu lead-free solder with the addition of a small amount of magnesium.AuthorsHuang, Her-Yueh; Yang, Chung-Wei; Peng, Yu-ChangPublicationScience & Engineering of Composite Materials, 2016, Vol 23, Issue 6, p641ISSN0792-1233Publication typeArticleDOI10.1515/secm-2014-0130