Back to matchesWe found a matchYour institution may have access to this item. Find your institution then sign in to continue.TitleMachine Learning‐Based Solution for Thermomechanical Analysis of MMIC Packaging.AuthorsKang, Sumin; Lee, Jae Hak; Kim, Seung Man; Lim, Jaeseung; Park, Ah‐Young; Han, Seongheum; Song, Jun‐Yeob; Kim, Seong‐IlPublicationAdvanced Materials Technologies, 2023, Vol 8, Issue 5, p1ISSN2365-709XPublication typeArticleDOI10.1002/admt.202201479