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- Title
The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys.
- Authors
Tan, Xin F.; Hao, Qichao; Zhou, Jiye; McDonald, Stuart D.; Sweatman, Keith; Nogita, Kazuhiro
- Abstract
With low liquidus temperatures, low raw material costs, and non-toxicity, Sn-Bi low-temperature solders are promising candidates for the replacement of the currently widely-used lead-free solders in situations in which process temperatures have to be reduced. Electrical resistivity is one of the most important properties of solder alloys, as one of their primary functions is to conduct electrons between the connected components. The electrical resistivity of an alloy of a given composition at a specific temperature and pressure is affected by the microstructure and the crystal structure of the phases present. For Sn-Bi solders, the solubility of Bi in Sn is highly temperature-sensitive and increases from 3 wt.% at room temperature to 21 wt.% at 139°C, the eutectic temperature of the Sn-Bi system. As the temperature increases within that interval, Bi will dissolve in Sn, while it will precipitate as the temperature decreases. The resulting significant changes in the overall microstructure and the lattice parameters of the Sn phase can be expected to affect the electrical resistivity. In this study, the electrical resistivity of hypo-eutectic Sn-37wt.%Bi and near-eutectic Sn-57wt.%Bi alloys was measured as a function of temperature and the temperature coefficient of resistance (TCR) calculated. It was found that the electrical resistivity increases linearly with increasing temperature up to 70°C, while above 80°C, a deviation from the linear relationship was observed. This deviation is attributed to the rapid dissolution of Bi in Sn at 80°C and above.
- Subjects
ELECTRICAL resistivity; TEMPERATURE coefficient of electric resistance; TEMPERATURE effect; LEAD-free solder; SOLDER &; soldering; TIN alloys; COPPER-tin alloys
- Publication
Journal of Electronic Materials, 2024, Vol 53, Issue 3, p1183
- ISSN
0361-5235
- Publication type
Article
- DOI
10.1007/s11664-023-10849-1