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- Title
Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints.
- Authors
Liu, Shengfa; Hu, Zhebing; Xiong, Jieran; Tan, Guanghua; Xiong, Wenyong; Chen, Chen; Huang, Shangyu
- Abstract
Two kinds of Sn-3.5Ag eutectic solder ribbons of 0.13 mm thickness were prepared by a casting-rolling process and a rapid solidification process. The microstructure, phase constitution, melting characteristics, wetting behavior and soldering strength were compared using optical microscopy, scanning electron microscopy, x-ray diffraction, energy dispersive spectroscopy, differential scanning calorimetry and a MTS ceramic testing system. The results show that the microstructure of rapidly solidified solder is finer and more uniform, and the eutectic structure has a higher solid solubility and more homogeneous distribution of Ag in a Sn matrix. The solidus and liquidus temperature decreased, resulting in a 3.3% reduction of pasty range. In addition, the wettability and shear strength of the solder joints increased by 13.2% and 7.9%, respectively.
- Subjects
EUTECTICS; SOLDERING equipment; SOLDER joints; MICROSCOPY; SCANNING electron microscopy
- Publication
Journal of Electronic Materials, 2017, Vol 46, Issue 11, p6373
- ISSN
0361-5235
- Publication type
Article
- DOI
10.1007/s11664-017-5672-9