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- Title
Microstructure and Solderability of Zn-6Al- xSn Solders.
- Authors
Yang, Xiaojun; Hu, Wei; Yan, Xin; Lei, Yongping
- Abstract
The eutectic point of Zn-6Al alloy is 381°C, and the peritectic reaction of Zn-Al-Sn alloy occurs at 280°C. In order to find an alloy with an appropriate melting point between 280°C and 340°C, Zn-6Al-5Sn, Zn-6Al-10Sn, Zn-6Al-15Sn, and Zn-6Al-20Sn alloys were prepared. The microstructure, melting behavior, and wettability of the Zn-6Al- xSn solder alloys were investigated by scanning electron microscopy (SEM), differential scanning calorimetry (DSC), and the sessile drop method. The results show that the alloys were composed of Zn-rich phase, Zn-Al structure, Sn-Zn-Al peritectic structure, and Sn-Zn eutectic structure. The progressive decrease of the liquidus temperature of the Zn-6Al- xSn solders was confirmed by the DSC results in the order: Zn-6Al-5Sn, Zn-6Al-10Sn, Zn-6Al-15Sn, Zn-6Al-20Sn. A decrease of the wetting angle, selected for evaluation of the solderability of the Zn-6Al- xSn solders, was observed in the same order. The cross-section of a solder joint on a Cu substrate was examined by SEM coupled with energy-dispersive x-ray (EDS) analysis.
- Subjects
ALUMINUM-zinc alloys; SOLDER &; soldering; LEAD-free solder; MICROSTRUCTURE; EUTECTIC point; WETTING; ENERGY dispersive X-ray spectroscopy
- Publication
Journal of Electronic Materials, 2015, Vol 44, Issue 4, p1128
- ISSN
0361-5235
- Publication type
Article
- DOI
10.1007/s11664-015-3651-6