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- Title
火场高温对潜在指纹显现的影响.
- Authors
韩喜渊; 张春宇; 金静; 张金专; 孙均利
- Abstract
In fire scene, the discovery and extraction of evidential fingerprints are valuable for identifying the relevant suspects or responsible persons. However, the fire scene is usually destructive and complex, resulting in the display of fingerprint there being difficult. Overseas scholars have explored the applicability of displaying reagents and ash removal for fire-baked fingerprint to develop. Currently, there is a lack of relevant researches on portable instruments to extract the on-site fingerprints at fire scene. In addition, few researches have seemed to conduct about the effectiveness of fingerprint display after long-duration exposure to high temperature in fire scene. Targeting at this situation, an experimental research was carried out, with the quartz resistant to high temperature being selected as the fingerprint carrier to explore portable instruments to recover the fingerprints survived at fire scene. The fingerprint samples were prepared under high-temperature conditions simulating the scene of a fire. Two methods, the optical nondestructive exposure and "502"glue fuming, were used to explore the impact of high temperature on fingerprint display. The results showed that the longer the baking time at the same temperature/the higher the baking temperature at the same time, the more serious the fingerprint damage. Optical nondestructive exposure can obtain good extraction results for fingerprints baked below 500 °C for about 10 minutes, or below 400 °C for 20-30 minutes, yet appearing worse presentation than the "502" glue fuming under all experimental conditions. Therefore, this research can provide reference for suitable choices ( e.g., the two methods adopted in this research) to extract and display the evidential fingerprints in fire scene.
- Subjects
HIGH temperatures; FORENSIC fingerprinting; FIRE investigation; QUARTZ; BAKING
- Publication
Forensic Science & Technology, 2023, Vol 48, Issue 2, p189
- ISSN
1008-3650
- Publication type
Article
- DOI
10.16467/j.1008-3650.2023.2002