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- Title
精密电铸模芯厚度均匀性的调控.
- Authors
杨忠豪; 蒋炳炎; 马志高; 杨 迪; 张 露
- Abstract
In electroforming processes, the nonuniform distribution of electric field at cathode edge led to a higher deposition rate at the edge, which resulted in the nonuniform thickness of electroformed mold insert. A cathode fixture with side grooves on top of the shielding baffle was designed herein. The research results show that the nonuniformity is as 4.3% with the thickness of electrodeposited layer is as 0.1 mm, which is the 16.5% of the nonuniformity without shielding plate. The precision injection mold insert with a thickness of 1.1 mm and thickness nonuniformity less than 8% was successfully fabricated based on the cathode side groove and shielding baffle.
- Subjects
ELECTROFORMING; CATHODES
- Publication
China Mechanical Engineering, 2023, Vol 34, Issue 21, p2531
- ISSN
1004-132X
- Publication type
Article
- DOI
10.3969/j.issn.1004-132X.2023.21.002