Found: 3
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An Electrical Testing Method for Blind Through Silicon Vias (TSVs) for 3D IC Integration.
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- Journal of Microelectronic & Electronic Packaging, 2011, v. 8, n. 4, p. 140, doi. 10.4071/imaps.307
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- Article
64-BIT PIPELINE CARRY LOOKAHEAD ADDER USING ALL-N-TRANSISTOR TSPC LOGICS.
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- Journal of Circuits, Systems & Computers, 2006, v. 15, n. 1, p. 13, doi. 10.1142/S0218126606002915
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- Publication type:
- Article
Low supply voltage and multiphase all‐digital crystal‐less clock generator.
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- IET Circuits, Devices & Systems (Wiley-Blackwell), 2018, v. 12, n. 6, p. 720, doi. 10.1049/iet-cds.2018.5149
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- Article