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- Title
Electronic Packaging Reliability Assessment.
- Abstract
RADC has developed a methodology for evaluating the reliability of wafer scale integration (WSI) devices when no previous reliability history exists. This method is also useful for hybrid devices or any advanced electronic packaging, such as radar transmit/receive modules and multi-chip modules. The method was developed by Hughes Aircraft under contract to RADC and is an extension of the finite element analysis work that RADC has been doing on advanced electronics for years. The methodology developed for the reliability assessment of WSI devices is based on the experience gained by RADC and Hughes in the analysis of electronic devices and packaging.
- Subjects
PACKAGING; RELIABILITY in engineering; WAFER-scale integration of circuits; ELECTRONIC packaging; MULTICHIP modules (Microelectronics); ELECTRONICS
- Publication
Quality & Reliability Engineering International, 1991, Vol 7, Issue 1, p50
- ISSN
0748-8017
- Publication type
Article