We found a match
Your institution may have access to this item. Find your institution then sign in to continue.
- Title
Solid-state interfacial reaction of eutectic Sn3.5Ag and pure tin solders with polycrystalline Cu substrate.
- Authors
Yang, Ming; Chen, Hongtao; Ma, Xin; Li, Mingyu; Cao, Yong; Kim, Jongmyung
- Abstract
Intermetallic compounds (IMCs) that form at eutectic Sn3.5Ag/Cu and pure Sn/Cu interfaces during solid-state aging are comparatively studied in terms of their respective morphological formations, orientation evolution behaviors, and growth kinetics. During solid-state aging, all the interfacial CuSn grains evolve into a layer-type morphology, except for select grains that experience abnormal growth. This abnormal growth is caused by the preferential growth of the CuSn at the grain boundary in solder matrix. Meanwhile, textured growth occurs in the CuSn layer formed at the eutectic Sn3.5Ag/Cu interface. The morphology of each texture is determined by the initial joint preparation conditions and affects the growth of interfacial IMCs. The results reveal that Sn diffusion occurs faster along the [0001] direction of the CuSn crystal than along angles from 25° to 50° relative to the [0001] direction. Additionally, the effects of solder composition on the interfacial IMC growth are evaluated. The results indicate that Ag addition retards IMC growth upon aging by inhibiting diffusion of Cu.
- Subjects
SOLID state chemistry; EUTECTIC alloys; TIN; SOLDER &; soldering; POLYCRYSTALS; INTERMETALLIC compounds; DIFFUSION; CRYSTAL grain boundaries
- Publication
Journal of Materials Science, 2014, Vol 49, Issue 10, p3652
- ISSN
0022-2461
- Publication type
Article
- DOI
10.1007/s10853-014-8069-7