Back to matchesWe found a matchYour institution may have access to this item. Find your institution then sign in to continue.TitleThermal scanning rheometric analysis of curing kinetic of an epoxy resin. I. An anhydride as curing agent.AuthorsAmpudia, J.; Larrauri, E.; Gil, E. M.; Rodríguez, M.; León, L. M.PublicationJournal of Applied Polymer Science, 1999, Vol 71, Issue 8, p1239ISSN0021-8995Publication typeArticleDOI10.1002/(SICI)1097-4628(19990222)71:8<1239::AID-APP4>3.0.CO;2-U