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Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1169, doi. 10.1007/s11664-023-10782-3
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- Article
Controlling the Layer Thickness of Zinc Oxide Photoanode and the Dye-Soaking Time for an Optimal-Efficiency Dye-Sensitized Solar Cell.
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- Coatings (2079-6412), 2023, v. 13, n. 1, p. 20, doi. 10.3390/coatings13010020
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- Article
Influence of Fin Thickness on the Thermal Performance and Selection of Coating Method for a Bus Duct Conductor.
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- Coatings (2079-6412), 2023, v. 13, n. 1, p. 12, doi. 10.3390/coatings13010012
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- Article
Metal-Doped TiO 2 Thin Film as an Electron Transfer Layer for Perovskite Solar Cells: A Review.
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- Coatings (2079-6412), 2023, v. 13, n. 1, p. 4, doi. 10.3390/coatings13010004
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- Article
High-Entropy Alloy for Thin Film Application: A Review.
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- Coatings (2079-6412), 2022, v. 12, n. 12, p. 1842, doi. 10.3390/coatings12121842
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- Article
Effect of Electromigration and Thermal Ageing on the Tin Whiskers' Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints.
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- Coatings (2079-6412), 2021, v. 11, n. 8, p. 935, doi. 10.3390/coatings11080935
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- Article
A SHORT REVIEW ON THE INFLUENCE OF ANTIMONY ADDITION TO THE MICROSTRUCTURE AND THERMAL PROPERTIES OF LEAD-FREE SOLDER ALLOY.
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- Archives of Metallurgy & Materials, 2023, v. 68, n. 3, p. 981, doi. 10.24425/amm.2023.145463
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- Article
THE INVESTIGATION OF GROUND GRANULATED BLAST FURNACE SLAG GEOPOLYMER AT HIGH TEMPERATURE BY USING ELECTRON BACKSCATTER DIFFRACTION ANALYSIS.
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- Archives of Metallurgy & Materials, 2022, v. 67, n. 1, p. 227, doi. 10.24425/amm.2022.137494
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- Article
Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process.
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- Metals (2075-4701), 2021, v. 11, n. 8, p. 1155, doi. 10.3390/met11081155
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- Article
The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint.
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- Metals (2075-4701), 2021, v. 11, n. 3, p. 380, doi. 10.3390/met11030380
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- Article
Alkaline-Activation Technique to Produce Low-Temperature Sintering Activated-HAp Ceramic.
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- Applied Sciences (2076-3417), 2023, v. 13, n. 4, p. 2643, doi. 10.3390/app13042643
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- Article
Bonding Strength Characteristics of FA-Based Geopolymer Paste as a Repair Material When Applied on OPC Substrate.
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- Applied Sciences (2076-3417), 2020, v. 10, n. 9, p. 3321, doi. 10.3390/app10093321
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- Article
Design, Modelling and Optimization of a Novel Concentrated Solar Powered (CSP) Flash Desalination System Involving Direct Heating and Pressure Modulation Using Response Surface Methodology (RSM).
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- Sustainability (2071-1050), 2022, v. 14, n. 18, p. 11558, doi. 10.3390/su141811558
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- Article
Microstructure Evolution of Ag/TiO<sub>2</sub> Thin Film.
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- Magnetochemistry, 2021, v. 7, n. 1, p. 1, doi. 10.3390/magnetochemistry7010014
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- Article
Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5Ag and Solder Joint Strength: Experimental and Finite Element Analysis.
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- Materials (1996-1944), 2023, v. 16, n. 12, p. 4360, doi. 10.3390/ma16124360
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- Article
Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint.
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- Materials (1996-1944), 2023, v. 16, n. 5, p. 1852, doi. 10.3390/ma16051852
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- Article
Mechanical Performance, Microstructure, and Porosity Evolution of Fly Ash Geopolymer after Ten Years of Curing Age.
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- Materials (1996-1944), 2023, v. 16, n. 3, p. 1096, doi. 10.3390/ma16031096
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- Article
Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy.
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- Materials (1996-1944), 2023, v. 16, n. 1, p. 96, doi. 10.3390/ma16010096
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- Article
Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow.
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- Materials (1996-1944), 2022, v. 15, n. 8, p. N.PAG, doi. 10.3390/ma15082758
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- Article
The Influence of Sintering Temperature on the Pore Structure of an Alkali-Activated Kaolin-Based Geopolymer Ceramic.
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- Materials (1996-1944), 2022, v. 15, n. 7, p. 2667, doi. 10.3390/ma15072667
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- Article
Recent Developments in Steelmaking Industry and Potential Alkali Activated Based Steel Waste: A Comprehensive Review.
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- Materials (1996-1944), 2022, v. 15, n. 5, p. 1948, doi. 10.3390/ma15051948
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- Article
Contribution of Interfacial Bonding towards Geopolymers Properties in Geopolymers Reinforced Fibers: A Review.
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- Materials (1996-1944), 2022, v. 15, n. 4, p. 1496, doi. 10.3390/ma15041496
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- Article
Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review.
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- Materials (1996-1944), 2022, v. 15, n. 4, p. 1451, doi. 10.3390/ma15041451
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- Article
Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing.
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- Materials (1996-1944), 2021, v. 14, n. 18, p. 5134, doi. 10.3390/ma14185134
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- Article
Influence of Sintering Temperature of Kaolin, Slag, and Fly Ash Geopolymers on the Microstructure, Phase Analysis, and Electrical Conductivity.
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- Materials (1996-1944), 2021, v. 14, n. 9, p. 2213, doi. 10.3390/ma14092213
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- Article
Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing.
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- Materials (1996-1944), 2021, v. 14, n. 4, p. 776, doi. 10.3390/ma14040776
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- Article
Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint.
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- Materials (1996-1944), 2021, v. 14, n. 4, p. 738, doi. 10.3390/ma14040738
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- Article
Strength Development and Elemental Distribution of Dolomite/Fly Ash Geopolymer Composite under Elevated Temperature.
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- Materials (1996-1944), 2020, v. 13, n. 4, p. 1015, doi. 10.3390/ma13041015
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- Article
Imaging the Polymorphic Transformation in a Single Cu6Sn5 Grain in a Solder Joint.
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- Materials (1996-1944), 2018, v. 11, n. 11, p. 2229, doi. 10.3390/ma11112229
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- Article
Surface Modification of GO/TiO<sub>2</sub> Thin Film by Sodium Dodecyl Sulphate for Photocatalytic Applications.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2024, v. 76, n. 8, p. 4028, doi. 10.1007/s11837-024-06694-0
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- Article