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- Title
Microstructure and mechanical properties of nano-Ag sintered joint enhanced by Cu foam.
- Authors
Liu, Yang; Li, Zhao; Zhang, Hao; Sun, Fenglian
- Abstract
Copper foam (Cu-F) was added into nano-Ag paste to obtain nano-Ag@Cu-F composite sintered joint. The microstructure, hardness, and shear behavior of the joints were investigated in comparison with the nano-Ag sintered joints. Experimental results indicated that the addition of Cu foam significantly decreased the void percentage at the sintered interface. The average hardness of the nano-Ag joints sharply increased from 0.64 to 1.46 GPa as the sintering time extended from 5 to 15 min. In contrast, the nano-Ag@Cu-F sintered layers were condensed within 5 min and the hardness reached 1.41 GPa. Further extension of the sintering time led to slow increase of the hardness. The shear strength of the sintered joints was enhanced due to the addition of Cu foam. Compared with the nano-Ag sintered joints, the composite joints showed greater shear distance to failure during the shear test. The shear fracture occurred in the sintered layer instead of the interface in the nano-Ag@Cu-F sintered joints since the bonding interface was enhanced by Cu foam addition. As the sintering time prolonged, the bonding quality of the sintered joints was improved and led to the increasing of shear strength.
- Subjects
MICROSTRUCTURE; SHEAR strength; HARDNESS; FOAM; LEAD time (Supply chain management)
- Publication
Journal of Materials Science: Materials in Electronics, 2019, Vol 30, Issue 16, p15795
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-019-01965-y