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- Title
SEM in-situ investigation on failure of nanometallic film/substrate structures under three-point bending loading.
- Authors
Xi-Shu Wang; Cheng-Kun Yan; Ying Li; Yibin Xue; Xiang-Kang Meng; Bi-Sheng Wu
- Abstract
Three-point bending tests on nanocrystalline Cu or Cu/Ni-film/Cu-substrate samples were conducted in-situ with scanning electron microscopy (SEM) observations. The SEM in-situ observations show undulation deformation of the surface of thin film, as the thin film fractures easily at the concave–convex points of deformation and multi-cracks appear on the surface of the thin film in a periodic fashion. The critical wavelength of undulation is calculated based on experimental observations, which are comparable with the theoretical predictions. For the Cu/Ni multi-layered films/substrate structures, the micro-cracking pattern depends on the interfacial strength between the film and the substrate, rather than the interfacial strength between the layers of films.
- Subjects
NANOCRYSTALS; BENDING (Metalwork); SCANNING electron microscopy; THIN films; CHROMOGENIC compounds; DEFORMATION of surfaces
- Publication
International Journal of Fracture, 2008, Vol 151, Issue 2, p269
- ISSN
0376-9429
- Publication type
Article
- DOI
10.1007/s10704-008-9257-8