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- Title
Reversible 'Wetting' of grain boundaries by the second solid phase in the Cu-In system.
- Authors
Straumal, B.; Kogtenkova, O.; Kolesnikova, K.; Straumal, A.; Bulatov, M.; Nekrasov, A.
- Abstract
The reversible wetting of grain boundaries by the second solid phase in the copper-indium system has been observed. With an increase in the temperature, the contact angle θ between the (Cu)/(Cu) grain boundary in a Cu-based solid solution based and particles of the δ-phase (CuIn) decreases gradually. Above T = 370°C, the first (Cu)/(Cu) grain boundaries completely 'wetted' by the δ phase appear in Cu-In polycrystals. In other words, the δ phase forms continuous layers along grain boundaries and θ = 0. At 440°C, the fraction of completely wetted grain boundaries reaches a maximum (93%), whereas the average contact angle reaches a minimum (θ = 2°). With a further increase in the temperature, the fraction of completely wetted grain boundaries decreases and vanishes again at T = 520°C. This phenomenon can be explained by an anomalous shape of the solubility limit curve of indium in a solid solution (Cu).
- Subjects
CRYSTAL grain boundaries; SOLID-phase analysis; WETTING; COPPER alloys; POLYCRYSTALS; SOLID solutions
- Publication
JETP Letters, 2014, Vol 100, Issue 8, p535
- ISSN
0021-3640
- Publication type
Article
- DOI
10.1134/S0021364014200107