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- Title
Synthesis and properties of two novel silicon-containing cycloaliphatic epoxy resins for electronic packaging application.
- Authors
Liu, Wanshuang; Wang, Zhonggang; Chen, Zhuo; Li, Jianfeng; Zhao, Linni
- Abstract
In this paper, two silicon-containing cycloaliphatic olefins were synthesized through the nucleophilic substitution reactions of cyclohex-3-enyl-1-methanol with di- or tri-chlorosilane compounds. Then, after epoxidation, two new cycloaliphatic epoxy resins with different epoxy groups were successfully prepared. Their chemical structures were confirmed by 29Si NMR, 1H NMR, and Fourier-transform infrared spectra (FTIR). The properties of cured products, including viscoelasticity, glass transition temperature ( Tg), coefficient of thermal expansion, thermal stability and water absorption, were investigated. Compared to the difunctional epoxy resin, the trifunctional one exhibited a remarkably increased cross-linking density from 0.82 to 4.08 × 10−3 mol/cm3 and Tg from 157 to 228°C. More importantly, prior to curing, they had viscosities of only 240-290 mPa sec at 25°C, which were much lower than that of ERL-4221 (409 mPa sec), providing the possibility of easy processing. The high glass transition temperatures, good thermal stabilities, and mechanical properties as well as excellent flowability endow the silicon-containing epoxy resins with promising potential in microelectronic packaging application. Copyright © 2011 John Wiley & Sons, Ltd.
- Subjects
EPOXY resins; SILICON; CYCLOHEXENYL compounds; EPOXIDATION; CHEMICAL structure; GLASS transition temperature
- Publication
Polymers for Advanced Technologies, 2012, Vol 23, Issue 3, p367
- ISSN
1042-7147
- Publication type
Article
- DOI
10.1002/pat.1882