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- Title
The growth kinetics of intermetallic layers at the interface of a solid metal and a liquid solder.
- Authors
Dybkov, V. I.
- Abstract
During soldering, intermetallic layers can occur at the interface of a solid metal and the saturated or undersaturated solder melt. In systems with a considerable solubility in the liquid state, dissolution causes a manifold drop in layer thickness. Mathematical equations are proposed to evaluate the thickness of any intermetallic layer formed under conditions of simultaneous dissolution in the undersaturated solder melt. The main features of reactive phase formation at the solid metalliquid solder interface are illustrated using the Co-Sn couple with the growing CoSn3 (250°C) and CoSn2 (350°C and 450°C) layers as examples.
- Subjects
DYNAMICS; WELDING; MATHEMATICS; FLUIDS; COPYING
- Publication
JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2009, Vol 61, Issue 1, p76
- ISSN
1047-4838
- Publication type
Article
- DOI
10.1007/s11837-009-0015-9