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- Title
HEAT DISSIPATION PERFORMANCE OF GROOVED-TYPE AND COPPER FOAM-TYPE VAPOR CHAMBERS.
- Authors
Leiqing WANG; Donghui ZHANG; Yi CHEN; Lili SUN; Jijing MAO
- Abstract
Both grooved-type and copper foam-type vapor chambers are explored and investigated. The overall performance of vapor chamber depends on both axial and spread thermal resistance mutually. The copper foam-type vapor chambers achieved the lowest axial thermal resistance less than 0.2 K/W. The grooved-type sample presented the lowest spread thermal resistance, indicating better temperature uniformity. The visual experiment demonstrated that the evaporating surface of the copper-foam vapor chamber was dominated by the thin film evaporation mechanism at low charging ratio while dominated by the pulsed pool boiling mechanism at large charging ratio. For the grooved-type vapor chamber, the pool boiling mode was observed at any charging ratio.
- Subjects
GASES; EBULLITION; VAPORS; COPPER; FOAM; THIN films; THERMAL resistance
- Publication
Thermal Science, 2022, Vol 26, Issue 2B, p1357
- ISSN
0354-9836
- Publication type
Article
- DOI
10.2298/TSCI200821141W