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- Title
Electroplated Indium Bumps as Thermal and Electrical Connections of NTD-Ge Sensors for the Fabrication of Microcalorimeter Arrays.
- Authors
Lo Cicero, U.; Arnone, C.; Barbera, M.; Collura, A.; Lullo, G.
- Abstract
We are developing a method to build arrays of Ge-based microcalorimeters for soft X-rays detection using micro-photolithographic techniques. A key element of the process is the electrical and thermal connection between the germanium sensors and the interconnection electrical tracks, that lay on a substrate acting as mechanical support and thermal sink. The geometry of the sensors, that have a square base truncated pyramid shape, makes feasible a connection through indium soldering. We describe a technique, based on microlithography and electroplating, adopted to grow indium bumps of a few tens of square microns of area and several microns high on top of the contact pads patterned on the substrate. The sensor array is placed over the bumps and a subsequent baking melts the indium, soldering the sensors to the pads.
- Subjects
INDIUM; ELECTRIC connectors; MICROFABRICATION; CALORIMETERS; NEUTRON transmutation doping of semiconductors; ELECTROPLATING; GERMANIUM diodes; X-ray spectroscopy; FLIP chip technology
- Publication
Journal of Low Temperature Physics, 2012, Vol 167, Issue 3/4, p535
- ISSN
0022-2291
- Publication type
Article
- DOI
10.1007/s10909-012-0560-4