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- Title
磯化硅过渡热沉对C-mount封装激光器散热的影响.
- Authors
吴胤稹; 柳祎; 高全宝; 冯源; 晏长岭; 李洋; 刘国军
- Abstract
In order to improve heat dissipation performance of semiconductor laser, high thermal conductivity silicon carbide(SiC) material is added as transitional heat sink on the basis of C-mount package. By means of finite element analysis, the optimal SiC structural parameters were obtained: the thickness 0.4 mm, the height 1.9 mm, and the width 6.35 mm. The chip was packaged with wavelength 808 nm, power 10 W and cavity length 1.5 mm. Theoretical thermal simulation and experimental test were carried out on the design results. The simulation results are verified by experimental tests. The experimental results show that the laser thermal resistance, output power and electro-optic conversion efficiency are 4.08 ℃/W, 17.8 W and 61.5% respectively. The feasibility of SiC structural parameter design is also verified. Compared to conventional lasers, the design scheme in this work reduces the thermal resistance of semiconductor laser by 0.49 ℃/W, and increases the power and electro-optical conversion efficiency by 10%.
- Subjects
THERMAL conductivity; FINITE element method; HEAT sinks; SILICON carbide; THERMAL resistance; STRUCTURAL design; SEMICONDUCTOR lasers; THERMOELECTRIC generators
- Publication
China Sciencepaper, 2019, Vol 14, Issue 12, p1362
- ISSN
2095-2783
- Publication type
Article