We found a match
Your institution may have access to this item. Find your institution then sign in to continue.
- Title
Integrated computational analysis of digital photoelasticity and thermoelastic stress analysis.
- Authors
Yefferson Aristizabal-López, Yeins; Briñez de León, Juan Carlos; Restrepo-Martínez, Alejandro; Alexander Fandiño-Toro, Hermes
- Abstract
Stress measurement is useful to identify the operating conditions that can produce the failure of a structure. Among the strategies for stress measurement, the integration between digital photoelasticity and thermoelastic stress analysis has been extensively explored, because it is useful to determine the individual stresses, and because of its full-field capabilities. However, due to the experimental complexity of both techniques, their integration is often limited to semistatic cases, where the calibration of the thermal parameters is usually done independently of the photoelasticity experiment. This paper describes a computational integration of digital photoelasticity and thermoelastic stress analysis. The main contribution of the paper is to show that, under controlled conditions, the application of variable load can be used to determine the stress and temperature fields of a birefringent model. The results achieved of this paper could be useful in industrial environments, where the complexity of the experiments limits the range of applications that require stress field analysis.
- Subjects
THERMOELASTIC stress analysis; PHOTOELASTICITY; STRAINS &; stresses (Mechanics); BIREFRINGENCE
- Publication
Visión Electrónica, 2022, Vol 16, Issue 1, p1
- ISSN
1909-9746
- Publication type
Article
- DOI
10.14483/issn.2248-4728