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First Principles Study of Mechanical Properties and Electronic Structures of Vanadium‐Doped TiC and TiN.
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- Advanced Engineering Materials, 2018, v. 20, n. 10, p. N.PAG, doi. 10.1002/adem.201800295
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- Article
Study on creep characterization of nano-sized Ag particle-reinforced Sn–Pb composte solder joints.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 3, p. 256, doi. 10.1007/s10854-009-9902-7
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- Article
Effects of small amounts of Ni/P/Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 10, p. 1008, doi. 10.1007/s10854-008-9826-7
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- Article
Investigation on impact strength of the as-soldered Sn37Pb and Sn3.8Ag0.7Cu solder joints.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 6, p. 499, doi. 10.1007/s10854-008-9757-3
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- Article
Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints.
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- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 2, p. 186, doi. 10.1007/s10854-008-9696-z
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- Article
Creep property of composite solders reinforced by nano-sized particles.
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- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 4, p. 349, doi. 10.1007/s10854-007-9327-0
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- Article
Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints.
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- Journal of Electronic Materials, 2018, v. 47, n. 3, p. 2073, doi. 10.1007/s11664-017-6014-7
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- Article
Effect of Powder Morphologies on the Property of Conductive Silicone Rubber Filled with Carbonyl Nickel Powder.
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- Journal of Electronic Materials, 2017, v. 46, n. 11, p. 6306, doi. 10.1007/s11664-017-5601-y
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- Article
The Failure Models of Lead Free Sn-3.0Ag-0.5Cu Solder Joint Reliability Under Low-G and High-G Drop Impact.
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- Journal of Electronic Materials, 2017, v. 46, n. 2, p. 1396, doi. 10.1007/s11664-016-5027-y
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- Article
Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders.
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- Journal of Electronic Materials, 2016, v. 45, n. 11, p. 5800, doi. 10.1007/s11664-016-4366-z
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- Article
Microstructure and Solderability of Zn-6Al- xSn Solders.
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- Journal of Electronic Materials, 2015, v. 44, n. 4, p. 1128, doi. 10.1007/s11664-015-3651-6
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- Article
Effect of Ag Content on Solidification Cracking Susceptibility of Sn-Ag-Cu Solder Joints.
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- Journal of Electronic Materials, 2010, v. 39, n. 8, p. 1298, doi. 10.1007/s11664-010-1175-7
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- Article
Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration.
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- Journal of Electronic Materials, 2009, v. 38, n. 12, p. 2756, doi. 10.1007/s11664-009-0944-7
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- Article
Effect of Thermal Aging on Impact Absorbed Energies of Solder Joints Under High-Strain-Rate Conditions.
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- Journal of Electronic Materials, 2009, v. 38, n. 10, p. 2132, doi. 10.1007/s11664-009-0872-6
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- Article
Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints.
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- Journal of Electronic Materials, 2009, v. 38, n. 9, p. 1906, doi. 10.1007/s11664-009-0839-7
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- Article
Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles.
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- Journal of Electronic Materials, 2009, v. 38, n. 9, p. 1866, doi. 10.1007/s11664-009-0840-1
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- Article
Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test.
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- Journal of Electronic Materials, 2008, v. 37, n. 10, p. 1631, doi. 10.1007/s11664-008-0506-4
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- Article
Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy.
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- Journal of Electronic Materials, 2008, v. 37, n. 7, p. 982, doi. 10.1007/s11664-008-0458-8
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- Article
Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles.
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- Journal of Electronic Materials, 2008, v. 37, n. 4, p. 507, doi. 10.1007/s11664-007-0208-3
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- Article
Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging.
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- Journal of Electronic Materials, 2008, v. 37, n. 1, p. 2, doi. 10.1007/s11664-007-0263-9
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- Article
Comparative Study of Microstructures and Properties of Three Valuable SnAgCuRE Lead-Free Solder Alloys.
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- Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1095, doi. 10.1007/BF02692572
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- Article
Effect of Rare Earth Element Addition on the Microstructure of Sn-Ag-Cu Solder Joint.
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- Journal of Electronic Materials, 2005, v. 34, n. 3, p. 217, doi. 10.1007/s11664-005-0207-1
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- Article
Shear strength and failure mode of self-piercing riveted similar and dissimilar materials.
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- International Journal of Advanced Manufacturing Technology, 2024, v. 133, n. 3/4, p. 1749, doi. 10.1007/s00170-024-13895-z
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- Article
EFFECT OF BORON CONTENT ON HIGH-TEMPERATURE OXIDATION RESISTANCE OF B-BEARING HIGH-SPEED STEEL.
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- Surface Review & Letters, 2020, v. 27, n. 12, p. 1, doi. 10.1142/S0218625X20500237
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- Article
EFFECT OF Cr<sub>3</sub>C<sub>2</sub> ADDITION ON THE MICROSTRUCTURE AND PROPERTIES OF LASER CLADDING NiCrBSi COATINGS.
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- Surface Review & Letters, 2019, v. 26, n. 6, p. N.PAG, doi. 10.1142/S0218625X18502074
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- Article
EFFECT OF Mo CONTENT ON MICROSTRUCTURE AND PROPERTIES OF LASER CLADDING Fe-BASED ALLOY COATINGS.
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- Surface Review & Letters, 2018, v. 25, n. 3, p. 1, doi. 10.1142/S0218625X18500774
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- Article
Oxidization-Induced Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0Er Alloy.
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- Metallurgical & Materials Transactions. Part A, 2009, v. 40, n. 8, p. 2016, doi. 10.1007/s11661-009-9871-8
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- Article
Lead-free solders with rare earth additions.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2009, v. 61, n. 6, p. 39, doi. 10.1007/s11837-009-0086-7
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- Article
Experimental and ab initio study of the influence of a compound modifier on carbidic ductile iron.
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- Metallurgical Research & Technology, 2019, v. 116, n. 3, p. N.PAG, doi. 10.1051/metal/2018124
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- Article
Effects of modification on microstructure and properties of Al-bearing high-boron high-speed steel.
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- Metallurgical Research & Technology, 2019, v. 116, n. 1, p. N.PAG, doi. 10.1051/metal/2018126
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- Article
Effect of Cobalt on Microstructure and Wear Resistance of Ni-Based Alloy Coating Fabricated by Laser Cladding.
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- Metals (2075-4701), 2017, v. 7, n. 12, p. 551, doi. 10.3390/met7120551
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- Article
Microstructure, thermal behavior, and wettability of Zn4Al3Mg-xIn solders.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 7537, doi. 10.1007/s10854-015-3390-8
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- Article
Comparison of drop performance between the Sn37Pb and the Sn3.8Ag0.7Cu solder joints subjected to drop test.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 3, p. 292, doi. 10.1007/s10854-010-0131-x
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- Article
Investigation of rare earth-doped BiAg high-temperature solders.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 9, p. 875, doi. 10.1007/s10854-009-0010-5
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- Article
Numerical modeling of pressure resistance welding of zirconium alloy tube-end plug joint.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 5/6, p. 3337, doi. 10.1007/s00170-022-09513-5
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- Article
Measurement of internal residual stress field in multi-layer fillet welded joint of ultra-thick circular plate and tube.
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- International Journal of Advanced Manufacturing Technology, 2019, v. 105, n. 5/6, p. 2329, doi. 10.1007/s00170-019-04391-w
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- Article
Effect of Molybdenum on the Microstructures and Properties of Stainless Steel Coatings by Laser Cladding.
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- Applied Sciences (2076-3417), 2017, v. 7, n. 10, p. 1065, doi. 10.3390/app7101065
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- Article
A study of microstructure and properties of cast Fe-10Cr-1.5B alloy.
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- China Foundry, 2014, v. 11, n. 3, p. 185
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- Article
On microstructure and performance of tempered high-boron high-speed steel roll.
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- China Foundry, 2012, v. 9, n. 3, p. 252
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- Article
Thermodynamic and Kinetic Analysis of Austenite Homogenization on Carbidic Ductile Iron.
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- Steel Research International, 2019, v. 90, n. 11, p. N.PAG, doi. 10.1002/srin.201900256
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- Article
Effects of electromigration on resistance changes in eutectic SnBi solder joints.
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- Journal of Materials Science, 2011, v. 46, n. 10, p. 3544, doi. 10.1007/s10853-011-5265-6
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- Article
Effect of boron concentration on the corrosion resistance of cast B-bearing steel in molten zinc.
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- Materials & Corrosion / Werkstoffe und Korrosion, 2008, v. 59, n. 12, p. 948, doi. 10.1002/maco.200805004
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- Article