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- Title
Analysis of Kinetic and Nucleation Mechanisms of Electrodeposited Copper on Indium Tin Oxide Thin Films.
- Authors
Nehaoua, K.; Zouaoui, A.; Khaniche, B.; Satour, F. Z.; Zegadi, A.
- Abstract
In this paper, we report an electrochemical study using cyclic voltammetry and chronoamperometry on the kinetic and nucleation mechanisms of electrodeposited copper on indium-doped tin oxide-coated glass substrates from sulfate solutions. The present investigation has been carried out in an acid solution at pH = 5. The Scharifker–Hills model was used to analyze current transients. At relatively low overpotentials, copper deposition is observed to follow a model that involves instantaneous nucleation and diffusion-controlled 3D growth. The diffusion coefficient for Cu2+ for various applied potentials is determined. Atomic force microscopy (AFM) has been used to check the surface morphology of the electrodeposited thin films.
- Subjects
INDIUM tin oxide; OXIDE coating; THIN films; COPPER; ATOMIC force microscopy; NUCLEATION; ELECTROCRYSTALLIZATION
- Publication
Journal of Electronic Materials, 2020, Vol 49, Issue 2, p1308
- ISSN
0361-5235
- Publication type
Article
- DOI
10.1007/s11664-019-07793-4