We found a match
Your institution may have access to this item. Find your institution then sign in to continue.
- Title
Formation of a Copper Contact Grid on the Surface of Silicon Heterojunction Solar Cells.
- Authors
Abolmasov, S. N.; Abramov, A. S.; Verbitskii, V. N.; Shelopin, G. G.; Kochergin, A. V.; Terukov, E. I.
- Abstract
A comparative analysis of various methods of forming a copper (Cu) contact grid on the surface of silicon heterojunction solar cells (SHJ SC) as an alternative to the standard screen printing method using expensive silver-containing (Ag) pastes is presented. It has been shown that the use of inkjet printing for the formation of protective dielectric masks based on an organic polymer and thin buffer metal layers for the growth of a Cu contact grid by electroplating makes it possible to form a contact grid of the required shape and having sufficient adhesion to the surface of SHJ SC. Using this method, double-sided SHJ SC (size 157 × 157 mm2) with Cu contact mesh were fabricated, demonstrating an efficiency of 22.9% and an adhesion level of 3–5 N/mm compared to 22.6% and 1.5–2 N/mm using a similar contact mesh based on Ag paste.
- Subjects
SILICON solar cells; SILICON surfaces; SCREEN process printing; COPPER; SILVER; BUFFER layers
- Publication
Semiconductors, 2023, Vol 57, Issue 10, p431
- ISSN
1063-7826
- Publication type
Article
- DOI
10.1134/S1063782623090014