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- Title
THERMAL VISCOELASTIC ANALYSIS OF PLASTIC COMPONENTS CONSIDERING RESIDUAL STRESS.
- Authors
CHOI, CHEL WOO; JEOUNG, KAB SIK; MOON, HYUNG-IL; KIM, HEON YOUNG
- Abstract
Plastics is commonly used in consumer electronics because of it is high strength per unit mass and good productivity, but plastic components may often become distorted after injection molding due to residual stress after the filling, packing, and cooling processes. In addition, plastic deteriorates depending on various temperature conditions and the operating time, which can be characterized by stress relaxation and creep. The viscoelastic behavior of plastic materials in the time domain can be expressed by the Prony series using the ABAQUS commercial software package. This paper suggests a process for predicting post-production deformation under cyclic thermal loading. The process was applied to real plastic panels, and the deformation predicted by the analysis was compared to that measured in actual testing, showing the possibility of using this process for predicting the post-production deformation of plastic products under thermal loading.
- Subjects
PLASTICS research; ELECTRIC properties of plastics; MIXING of plastics; MOLDING of plastics; SYNTHETIC products; ELECTRONIC industries
- Publication
International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics, 2008, Vol 22, Issue 31/32, p6241
- ISSN
0217-9792
- Publication type
Article
- DOI
10.1142/S0217979208051856