Back to matchesWe found a matchYour institution may have access to this item. Find your institution then sign in to continue.TitleInvestigation of the microstructure and toughness of 550 MPa grade pipeline after the hot-bending process.AuthorsWang, X. L.; Tsai, Y. T.; Yang, J. R.; Shang, C. J.; Wang, X. M.; Dong, L. M.; Yang, W. W.PublicationMaterials Science & Technology, 2016, Vol 32, Issue 7, p664ISSN0267-0836Publication typeArticleDOI10.1080/02670836.2015.1118793