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- Title
Editorial.
- Authors
Coates, Phil
- Abstract
Information about several papers discussed at the biennial Polymer Process Engineering series of international meetings from July 3-4, 2007 in the U.S. is presented. A paper on substrates for flexible electronics was tackled by Bill McDonald from DuPont Teijin Films. Robin Kent addressed energy efficiency through detailed monitoring and analysis of a wide range of polymer processing companies. Rudi Koopmans of Dow Benelux NV raised issues on sustainable technologies for innovative materials.
- Subjects
UNITED States; CONFERENCES &; conventions; POLYMERS conferences; KENT, Robin; KOOPMANS, Rudi; MCDONALD, Bill; DOW Benelux NV; DUPONT Teijin Films US LP
- Publication
Plastics, Rubber & Composites, 2008, Vol 37, Issue 2-4, p39
- ISSN
1465-8011
- Publication type
Article
- DOI
10.1179/174328908X283249