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- Title
A Robust Cooling Platform for NIS Junction Refrigeration and sub-Kelvin Cryogenic Systems.
- Authors
Wilson, B.; Atlas, M.; Lowell, P.; Moyerman, S.; Stebor, N.; Ullom, J.; Keating, B.
- Abstract
Recent advances in Normal metal-insulator-superconductor (NIS) tunnel junctions (Clark et al. Appl Phys Lett 86: 173508, , Appl Phys Lett 84: 4, ) have proven these devices to be a viable technology for sub-Kelvin refrigeration. NIS junction coolers, coupled to a separate cold stage, provide a flexible platform for cooling a wide range of user-supplied payloads. Recently, a stage was cooled from 290 to 256 mK (Lowell et al. Appl Phys Lett 102: 082601 ), but further mechanical and electrical improvements are necessary for the stage to reach its full potential. We have designed and built a new Kevlar suspended cooling platform for NIS junction refrigeration that is both lightweight and well thermally isolated; the calculated parasitic loading is $$<\!\!300$$ pW from 300 to 100 mK. The platform is structurally rigid with a measured deflection of 25 $$\upmu $$ m under a 2.5 kg load and has an integrated mechanical heat switch driven by a superconducting stepper motor with thermal conductivity G $$ = 4.5 \times 10^{-7}$$ W/K at 300 mK. An integrated radiation shield limits thermal loading and a modular platform accommodates enough junctions to provide nanowatts of continuous cooling power. The compact stage size of 7.6 cm $$\times $$ 8.6 cm $$\times $$ 4.8 cm and overall radiation shield size of 8.9 cm $$\times $$ 10.0 cm $$\times $$ 7.0 cm along with minimal electrical power requirements allow easy integration into a range of cryostats. We present the design, construction, and performance of this cooling platform as well as projections for coupling to arrays of NIS junctions and other future applications.
- Subjects
METAL-insulator-semiconductor devices; ROBUST control; COOLING; SUPERCONDUCTING junction devices; CRYOGENICS; RADIATION shielding; THERMAL conductivity
- Publication
Journal of Low Temperature Physics, 2014, Vol 176, Issue 3/4, p243
- ISSN
0022-2291
- Publication type
Article
- DOI
10.1007/s10909-014-1136-2