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- Title
ISTFA 2018 CONTACTLESS OPTICAL/NANOPROBING EFA USER GROUP.
- Authors
Bockelman, Dan; Pendyala, Sweta
- Abstract
The article focuses on the Electronic Device Failure Analysis Society's 2018 International Symposium for Testing and Failure Analysis in the U.S. It highlights the Contactless Fault Isolation and Nanoprobing User Group, which featured a wide variety of discussions including lock-in thermography, 3D packaging technology impact on probing, challenges for sample prep, cross sectional nanoprobing, and EBIRCFI techniques at the advanced technology nodes
- Subjects
STRUCTURAL failures; TECHNOLOGICAL innovations; NANOPARTICLES; FAILURE analysis; PARTICLE beam focusing
- Publication
Electronic Device Failure Analysis, 2019, Vol 21, Issue 1, p40
- ISSN
1537-0755
- Publication type
Proceeding