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- Title
Progress in the Copper-Based Diamond Composites for Thermal Conductivity Applications.
- Authors
Chen, Kang; Leng, Xuesong; Zhao, Rui; Kang, Yiyao; Chen, Hongsheng
- Abstract
Copper-based diamond composites have been the focus of many investigations for higher thermal conductivity applications. However, the natural non-wetting behavior between diamond particles and copper matrix makes it difficult to fabricate copper-based diamond composites with high thermal conductivity. Thus, to promote wettability between copper and diamond particles, the copper/diamond interface must be modified by coating alloying elements on the diamond surface or by adding active alloying elements with carbon in the copper matrix. In this paper, we review the research progress on copper-based diamond composites, including theoretical models for calculating the thermal conductivity and the effect of process parameters on the thermal conductivity of copper-based diamond composites. The factors that affect interfacial thermal conductivity are emphatically analyzed in this review. Finally, the current problems of copper-based diamond composites and future research trends are recommended.
- Subjects
THERMAL conductivity; COPPER; DIAMOND surfaces; NANODIAMONDS; DIAMONDS; SURFACE preparation
- Publication
Crystals (2073-4352), 2023, Vol 13, Issue 6, p906
- ISSN
2073-4352
- Publication type
Article
- DOI
10.3390/cryst13060906