Found: 45
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Topological Insulator TlBiSe<sub>2</sub>/GaN Vertical Heterojunction Diode for High Responsive Broadband UV to Near-Infrared Photodetector.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1561, doi. 10.1007/s11664-023-10889-7
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- Article
Optimization of Non-fullerene Organic Photovoltaics Through Interface Engineering with Graphene Oxide: A Numerical Simulation.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1539, doi. 10.1007/s11664-023-10911-y
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- Article
Single-Layer Terahertz Tri-band Bandpass Filter Employing High-Temperature Superconducting Metamaterial.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1642, doi. 10.1007/s11664-023-10898-6
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- Article
Performance Improvement of Photodetectors Based on ZIF-8 Nanostructures on Porous Silicon Substrate.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1577, doi. 10.1007/s11664-023-10892-y
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Machine Learning Algorithms in Photovoltaics: Evaluating Accuracy and Computational Cost Across Datasets of Different Generations, Sizes, and Complexities.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1530, doi. 10.1007/s11664-023-10897-7
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- Article
Enhanced Electrochemical Performance of Low-Content Graphene Oxide in Porous Co<sub>3</sub>O<sub>4</sub> Microsheets for Dual Applications of Lithium-Ion Battery Anode and Lithium-Ion Capacitor.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1517, doi. 10.1007/s11664-023-10903-y
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- Article
Carbon Nitride Supported Ultra-fine Bismuth Sulfide Based Supercapacitor for Low Frequency Oscillator Application.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1498, doi. 10.1007/s11664-023-10901-0
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- Article
Theoretical Studies on Structural, Electronic, Piezoelectric, and Optical Properties of Janus Sc<sub>2</sub>CXY (X ≠ Y, X/Y = F, Cl, Br, and I) MXenes.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1606, doi. 10.1007/s11664-023-10899-5
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- Article
Highly Efficient 3D–2D Perovskite Tandem Solar Cells: A Combined Ray Tracing and Transfer Matrix-Based Simulation Study.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1508, doi. 10.1007/s11664-023-10890-0
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- Article
Optimizing Heat-Treated Al-BDC@TiO<sub>2</sub> to Improve the Electrochemical Properties of Lithium-Sulfur Batteries.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1133, doi. 10.1007/s11664-023-10888-8
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- Article
Metamaterial Wave Absorber for Harvesting Electromagnetic Energy with Dispersion Characteristics Using Palm Oil Frond Graphitic Carbon.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1617, doi. 10.1007/s11664-023-10886-w
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- Article
An Improved Z-Shaped Dual-Material-Gate DM-SDZ-TFET Biosensor for Label-Free Detection.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1445, doi. 10.1007/s11664-023-10887-9
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- Article
Network Structure and Mechanical Properties of Flexible Electronic Interconnects based on Linear Low-Density Polyethylene (LLDPE) and Liquid Silicone Rubber (LSR) Conductive Polymer Composites.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1255, doi. 10.1007/s11664-023-10851-7
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- Article
Electron–Phonon Coupling and Carrier Relaxation Times in Gallium Antimonide Under Strain.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1161, doi. 10.1007/s11664-023-10877-x
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- Article
Study of Entropy Production of Magnetoelectric Multiferroic Materials.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1600, doi. 10.1007/s11664-023-10876-y
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- Article
A Cu Pillar Bump Bonding Method Using Au-Sn Alloy Cap as the Interconnection Layer.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1414, doi. 10.1007/s11664-023-10881-1
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- Article
Stereological Analysis of Microstructural Evolution Due to Aging in SnAgCu Solder Alloys.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1399, doi. 10.1007/s11664-023-10885-x
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- Article
Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1284, doi. 10.1007/s11664-023-10866-0
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- Article
Investigation of Quaternary BF-0.32PT-0.05BZ-xPNN Piezoelectric Ceramics with High Transduction Coefficient.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1590, doi. 10.1007/s11664-023-10884-y
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- Article
Activated Green Resources from Black Tiger Shrimp Shells to Produce O-N-P Self-Co-Doped Carbon Nanofiber for High-Performance Supercapacitor.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1487, doi. 10.1007/s11664-023-10880-2
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- Article
The Interfacial Reaction of Ni/In/Ni Sandwich Structure During Solid-State Isothermal Aging.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1264, doi. 10.1007/s11664-023-10865-1
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- Article
The Sensitizing Effect of Enhanced NO<sub>2</sub> Gas Sensing at Near-Room Temperature Using Pd-Decorated VO<sub>2</sub> Nanowires.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1461, doi. 10.1007/s11664-023-10878-w
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- Article
Microstructural Response of Highly Porous Sintered Nano-silver Particle Die Attachments to Thermomechanical Cycling.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1374, doi. 10.1007/s11664-023-10870-4
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- Article
The Effects of Core–Shell-Structured SiO<sub>2</sub>@Ag Spheres in Enhancing the Performance of Ag-Flake-Filled Electrically Conductive Adhesive and Insight into the Conduction Mechanism.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1272, doi. 10.1007/s11664-023-10864-2
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- Article
Changes in the Microstructure and Electrical Resistance of SnBi-Based Solder Joints during Current Stressing.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1299, doi. 10.1007/s11664-023-10875-z
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- Article
Dual Capacitive Behavior of Hollow Porous Gold Nanoparticle/Multi-Walled Carbon Nanotube Composite Films as Anode and Cathode Electrode Materials for Supercapacitors.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1476, doi. 10.1007/s11664-023-10874-0
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- Article
X-Ray Diffraction Studies of l-Isoleucine Under Shocked Conditions.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1634, doi. 10.1007/s11664-023-10873-1
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- Article
Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1201, doi. 10.1007/s11664-023-10855-3
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- Article
Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1192, doi. 10.1007/s11664-023-10853-5
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- Article
Incomplete Ionization-Dependent Carrier Mobility in Silicon-on-Insulator n-p-n Double-Gate Tunnel Field-Effect Transistors.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1142, doi. 10.1007/s11664-023-10852-6
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- Article
Study of Cu-Zn Spinel Ferrites on Europium Substitution for High-Frequency Applications.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1685, doi. 10.1007/s11664-023-10858-0
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- Article
Investigating the Effects of Rapid Precipitation of Bi in Sn on the Shear Strength of BGA Sn-Bi Alloys.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1223, doi. 10.1007/s11664-023-10850-8
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- Article
The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1183, doi. 10.1007/s11664-023-10849-1
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- Article
Prefabrication and Characterization of Copper–Silver Foam Composites for Low-Temperature Interconnection of Power Modules.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1360, doi. 10.1007/s11664-023-10785-0
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- Article
Superior Impact Ionization Rate in Deep Gate LDMOS Devices to Improve the Figure of Merit and Lattice Temperature.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1425, doi. 10.1007/s11664-023-10824-w
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- Article
Wetting Characteristics of Aluminum Droplets Before and After Embedding Carbon Atoms on the Surface of Heterologous Silicon Carbide.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1333, doi. 10.1007/s11664-023-10838-4
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- Article
Pressure Sintering of Micro-Silver Joints in SiC Power Devices: Optimization of Processing Parameters and FEM Analysis.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1313, doi. 10.1007/s11664-023-10822-y
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- Article
Optimization of Deposition Conditions of SrZrS<sub>3</sub> Perovskite Thin Films Grown by Chemical Bath Deposition.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1551, doi. 10.1007/s11664-023-10825-9
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- Article
In Situ Electrical Characterization of Transient Liquid-Phase Sintered Alloys.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1239, doi. 10.1007/s11664-023-10847-3
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- Article
Damage Mechanisms in Through-Silicon Vias Due to Thermal Exposure and Electromigration.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1214, doi. 10.1007/s11664-023-10845-5
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- Article
Design and Substrate Material-Based Analysis of a Sriyantra/Srichakra-Shaped Fractal Wideband Monopole Antenna for S-, C-, X-, and Ku-band Communication Applications.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1660, doi. 10.1007/s11664-023-10823-x
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- Article
Rice Husk Ash: Effective Reinforcement for Epoxy-Based Composites for Electronic Applications.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1344, doi. 10.1007/s11664-023-10835-7
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- Article
Design and Analysis of Self-Hexplexing Antenna Using SIW Hexagonal Cavity.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1651, doi. 10.1007/s11664-023-10831-x
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- Article
Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1169, doi. 10.1007/s11664-023-10782-3
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- Article
Electrical Performance of a Dual-Band Composite Radome.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1436, doi. 10.1007/s11664-023-10679-1
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- Article