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- Title
A Dynamic Model for the Assessment of the Replacement of Lead in Solders.
- Authors
Reuter, Markus A.; Verhoef, Ewoud V.
- Abstract
A dynamic, interactive map has been developed of the life cycle of a number of metals, from mining through to minerals processing, metal production, product manufacturing, recovery, and waste management. While the existing metal process network and waste management infrastructure provide substantial scope for (product) design, these also limit change because of the strong path dependency of industry and infrastructure development. Therefore, models for dynamic simulation were constructed that allow the specification and evaluation of the metal process network and waste management infrastructure "products" over a longer time span. The model has been constructed using a bottom-up approach, to enable assessment of the environmental aspects of metallurgy, and to simulate changes in the system structure and technology, i.e., from the reactor or individual process step up to integrated material cycles. This dynamic interconnected model is used to investigate the impact of the removal of lead from solders on the coupled flows of the metals Ag, Au, Bi, Cu, Fe, Ni, Pb, Sn, Zn, and PGMs.
- Subjects
METALS; MINERAL industries; WASTE management; TECHNOLOGY; SOLDER &; soldering
- Publication
Journal of Electronic Materials, 2004, Vol 33, Issue 12, p1567
- ISSN
0361-5235
- Publication type
Article
- DOI
10.1007/s11664-004-0100-3