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- Title
Effect of adherend temperature on bond strengths of resin bonding systems to denture base resin and a semi-precious alloy.
- Authors
MURAHARA, Sadaaki; MINAMI, Hiroyuki; SUZUKI, Shiro; SAKOGUCHI, Kenji; SHIOMUKI, Daisaku; MINESAKI, Yoshito; TANAKA, Takuo
- Abstract
This study investigated the effect of adherend temperature on shear bond strengths of auto-polymerizing resin to denture base resin and 4-META/MMA-TBBO resin to silver-palladium-copper-gold (Ag-Pd-Cu-Au) alloy. Bonding procedure was carried out when adherend temperature was 10, 23, 37, or 55°C, and shear bond strengths (SBSs) were measured before and after thermocycling. Before thermocycling, there were no significant differences in bond strength among the four adherend temperatures for each adhesive resin: 31.59±6.11-32.89±2.12 MPa for auto-polymerizing resin; 35.43±2.2-38.38±0.61 MPa for 4-META/MMA-TBBO resin. After thermocycling, optimal adherend temperature to achieve the highest bond strength was 37°C for auto-polymerizing resin to denture base resin (30.02±2.29 MPa) and 10°C for 4-META/MMA-TBBO resin to Ag-Pd-Cu-Au alloy (37.14±2.17 MPa).
- Subjects
BOND strengths; RESIN adhesives; ALLOYS; SHEAR strength; THERMOCYCLING; DENTURES
- Publication
Dental Materials Journal, 2013, Vol 32, Issue 2, p341
- ISSN
0287-4547
- Publication type
Article
- DOI
10.4012/dmj.2012-189