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- Title
Nanomechanical Measurements in Harsh Environments.
- Authors
Hosemann, Peter; Li, Xiaodong
- Abstract
The article discusses nanomechanical measurements in harsh environments as a technique to obtain micro-scale mechanical properties in extreme temperature environments. Particular focus is given to the method called micro-scale bend testing geometry proposed to find the elastic, plastic and fracture behavior of silicon around 770 degrees Celsius in the article by David E. J. Armstrong.
- Subjects
NANOSTRUCTURED materials testing; MATERIALS at high temperatures; MECHANICAL behavior of materials; SILICON testing; ELECTRIC properties of silicon; ARMSTRONG, David E. J.
- Publication
JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2015, Vol 67, Issue 12, p2900
- ISSN
1047-4838
- Publication type
Editorial
- DOI
10.1007/s11837-015-1676-1