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- Title
Hybrid 3D Printing of Molten Metal Microdroplets and Polymers for Prototyping of Printed Circuit Boards Featuring Interdigitated 3D Capacitors.
- Authors
Khan, Zeba; Gururajan, Dheepesh; Koltay, Peter; Kartmann, Sabrina; Zengerle, Roland; Shu, Zhe
- Abstract
This paper presents layer‐by‐layer additive manufacturing (AM) of molten metal microdroplets and dielectric materials to fabricate multilayer hybrid circuit boards featuring interdigitated 3D capacitors. The printed metal lines have a low resistance of 5 mΩ/mm, 12 times lower than state‐of‐the‐art conductive inks. Exploiting the advantages of Sn‐based oxide as an ideal candidate for Electrical Energy Storage Systems (ESS), we successfully fabricated an out‐of‐plane capacitor module using a combination of polymer and metal materials. The fabrication process exhibited an exceptional aspect ratio of 16, illustrating the successful incorporation of 20 metal layers in the out‐of‐plane capacitor module. Q factor obtained for the 3D capacitor was in the range of 66–500. Additionally, a fully automated printing technique was employed to produce a multilayer hybrid electrical printed circuit board (PCB), eliminating the need for post‐processing. This streamlined approach presents an efficient and comprehensive solution for the one‐stop printing of intricate electrical circuits. © 2024 The Authors. IEEJ Transactions on Electrical and Electronic Engineering published by Institute of Electrical Engineer of Japan and Wiley Periodicals LLC.
- Subjects
JAPAN; LIQUID metals; PRINTED circuits; THREE-dimensional printing; ENERGY storage; CAPACITORS; SEMICONDUCTOR manufacturing; CERAMIC capacitors; METALLIC oxides; ALUMINUM alloys
- Publication
IEEJ Transactions on Electrical & Electronic Engineering, 2024, Vol 19, Issue 5, p894
- ISSN
1931-4973
- Publication type
Article
- DOI
10.1002/tee.24035