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Title
TECHNOLOGY NEWS.
Abstract
Presents news on semiconductor technology in the United States as of July 2001. Information on a three-dimensional wafer-scale integration and interconnect technology developed by Ziptronix Inc.; Features of the MicroStar silicon chip technology from Lucent Technologies; Details on a cooperative research and development agreement between scientists at Oak Ridge National Laboratory, Motorola Labs and Pacific Northwest National Laboratory to study materials for integrated circuits.