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- Title
Microstructure, electrochemical and mechanical properties of novel Zn–Sn–Cu–Ni high-temperature solder containing a small amount of Al.
- Authors
Chen, Wenjing; Ye, Nan; Zhuo, Haiou; Liu, Wenlong; Tang, Jiancheng
- Abstract
A novel-type Zn–30Sn–2Cu–0.5Ni–0.2Al multicomponent high-temperature lead-free solder alloy was prepared, and its thermal behavior, electrochemical properties were investigated. Furthermore, the influences of isothermal aging on microstructure and mechanical properties of the alloy were explored. The results suggest that the liquidus temperature and melting heat of the Zn–Sn alloys decrease after adding Cu, Ni, and Al simultaneously, and the Zn–30Sn–2Cu–0.5Ni–0.2Al alloy exhibits the greatest undercooling level (23.9 °C). The prepared alloy has excellent corrosion resistance with the lowest corrosion current density (1.61 µA cm−2) and the lowest corrosion rate (0.02120 mm/a). Additionally, the morphology and quantity of Cu5Zn8 IMCs show prominent changes, while the formation and growth of (Ni, Cu)5Zn21 intermetallic compounds (IMCs) in the solder alloy are not changed after thermal aging. Meanwhile, the solder alloy also has the best mechanical properties after 5 days of aging, with an ultimate tensile strength (UTS) of 87.88 MPa, elongation of 32.5%.
- Publication
Journal of Materials Science: Materials in Electronics, 2023, Vol 34, Issue 23, p1
- ISSN
0957-4522
- Publication type
Article
- DOI
10.1007/s10854-023-11099-x