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- Title
Packaging and Antenna-Assembled Hybrid Stacked PCB with Novel Vertical Transition for 39 GHz 5G Base Stations.
- Authors
Youngju Lee; Dohyuk Ha; Kwanghyun Baek; Juneseok Lee; Sanghoon Park; Jung-Ho Park; Jinsu Heo; Jae Hee Kim
- Abstract
This paper proposes a novel packaging and large-scale antenna-assembled structure for a printed circuit board (PCB) that reinforces productivity, facilitates cost reduction, and maintains reliability. This was achieved by splitting the antenna from the main board and packaging it into a radio-frequency integrated circuit. In addition, two innovative solutions--an externally attachable flexible PCB antenna and a PCB-embedded coaxial line--are introduced to overcome the degradation in antenna performance and vertical RF transition loss in the proposed low-cost hybrid PCB. First, the proposed externally attachable flexible PCB antenna and a parasitic aircoupled antenna, which were easily assembled on the PCB, achieved an antenna efficiency of 95% and an impedance bandwidth of 7 GHz. Second, the fabricated coaxial line exhibited enhanced impedance matching over a wide frequency range of 30-40 GHz and improved insertion loss of approximately 1.4 dB. Furthermore, the packaged antenna, composed of 256 dual-polarized antenna elements per stream, incorporated a 39 GHz CMOS-based 16-channel phased-array transceiver IC. The set-level beam-forming measurements were verified considering an effective isotropic radiated power of 55 dBm at boresight and a steering range >±60°. In addition to being suitable for mass production in terms of cost and reliability, the proposed structures and solutions met the required antenna and beam-forming performance for commercial 39 GHz base stations without sacrificing performance.
- Subjects
PHASED array antennas; COAXIAL cables; ANTENNAS (Electronics); INSERTION loss (Telecommunication); IMPEDANCE matching; 5G networks
- Publication
Journal of Electromagnetic Engineering & Science, 2024, Vol 24, Issue 1, p26
- ISSN
2671-7255
- Publication type
Article
- DOI
10.26866/jees.2024.1.r.201