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- Title
Emerging Non-Noble-Metal Atomic Layer Deposited Copper as Seeds for Electroless Copper Deposition.
- Authors
Gao, Zihong; Zhang, Chengli; Wang, Qiang; Xu, Guanglong; Gan, Guoyou; Zhang, Hongliang
- Abstract
Copper metal catalyst seeds have recently triggered much research interest for the development of low-cost and high-performance metallic catalysts with industrial applications. Herein, we present metallic Cu catalyst seeds deposited by an atomic layer deposition method on polymer substrates. The atomic layer deposited Cu (ALD-Cu) can ideally substitute noble metals Ag, Au, and Pd to catalyze Cu electroless deposition. The optimized deposition temperature and growth cycles of an ALD-Cu catalyzed seed layer have been obtained to achieve a flexible printed circuit (FPC) with a high performance electroless plating deposited Cu (ELD-Cu) film. The ELD-Cu films on the ALD-Cu catalyst seeds grown display a uniform and dense deposition with a low resistivity of 1.74 μΩ·cm, even in the through via and trench of substates. Furthermore, the ALD-Cu-catalyzed ELD-Cu circuits and LED devices fabricated on treated PI also demonstrate excellent conductive and mechanical features. The remarkable conductive and mechanical characteristics of the ALD-Cu seed catalyzed ELD-Cu process demonstrate its tremendous potential in high-density integrated FPC applications.
- Subjects
ELECTROLESS deposition; COPPER films; FLEXIBLE printed circuits; ATOMIC layer deposition; ELECTROLESS plating; PRECIOUS metals; COPPER catalysts
- Publication
Materials (1996-1944), 2024, Vol 17, Issue 7, p1620
- ISSN
1996-1944
- Publication type
Article
- DOI
10.3390/ma17071620