Back to matchesWe found a matchYour institution may have access to this item. Find your institution then sign in to continue.TitleDamage of Integrated Circuits by High-Velocity Microparticles Penetrating Thick-Wall Obstacles.AuthorsRoman, O. V.; Dybov, O. A.; Romanov, G. S.; Usherenko, S. M.AbstractA flux of high-velocity microparticles, transmitted through a thick steel obstacle in the regime of superdeep penetration, also passes through the case of an integrated circuit (IC) situated behind this wall and produces damage of the IC chip. © 2005 Pleiades Publishing, Inc.SubjectsINTEGRATED circuits; ELECTRONIC circuits; INFORMATION technology; MICROELECTRONICS; STEEL; ELECTRONICSPublicationTechnical Physics Letters, 2005, Vol 31, Issue 1, p46ISSN1063-7850Publication typeArticleDOI10.1134/1.1859497