We found a match
Your institution may have access to this item. Find your institution then sign in to continue.
- Title
Mechanical Properties Measurement of PECVD Silicon Nitride after Rapid Thermal Annealing Using Nanoindentation Technique.
- Authors
Yan, H.-Y.; Ou, K.-S.; Chen, K.-S.
- Abstract
This paper presents the results of mechanical characterisation of residual stress, elastic modulus, hardness and fracture toughness of plasma-enhanced chemical vapour deposited (PECVD) silicon nitride films subjected to rapid thermal annealing (RTA), processed between 200 and 800 °C. Additional tensile residual stresses were generated during the RTA period and the stress reached peak values after a 400 °C RTA process. On the other hand, nanoindentation testing revealed that both the modulus and hardness varied significantly with different RTA temperatures. Finally, the fracture toughness of the nitride was estimated to be 1.33 MPa √m based on a series of Vickers micro-indentation tests and it can be enhanced by the RTA process. These results should be useful for microelectromechanical systems (MEMS) or integrated circuit (IC) structure fabrication as regards maintaining the structural integrity and improving fabrication performance.
- Subjects
PLASMA-enhanced chemical vapor deposition; SILICON nitride; RAPID thermal processing; RESIDUAL stresses; DEFORMATIONS (Mechanics)
- Publication
Strain, 2008, Vol 44, Issue 3, p259
- ISSN
0039-2103
- Publication type
Article
- DOI
10.1111/j.1475-1305.2007.00394.x