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- Title
Improving Adhesion Strength and Electrical Conductivity of Cold-Sprayed Al Deposit on Cu Substrate Through Friction-Stir-Processing.
- Authors
Ji, Gang; Liu, Hong; Yang, Guan-Jun; Luo, Xiao-Tao; Li, Cheng-Xin; Sun, Yu-Feng; Zhu, Shu-Hao; Zhao, Chen
- Abstract
In this study, cold spraying was introduced to produce an Al deposit on a Cu substrate, which was then modified through a solid-state method named friction-stir-processing (FSP). The pores and inter-particle interfaces within the Al deposit completely disappeared after FSP at traverse speeds less than 18 mm/min. Equiaxed grains containing a low density of dislocations occurred in the Al deposit after FSP. The grain size increased, while the dislocation density decreased with decreasing traverse speed. Meanwhile, three intermetallic compound (IMC) layers including Al2Cu, AlCu, and Al4Cu9 were developed at the Al/Cu interface after FSP. The thickness of the entire IMC layers and the continuity of the AlCu layer increased as the traverse speed was reduced. Due to the generation of the IMC layers, the adhesion strength of the deposit dramatically improved after FSP. The variation of the adhesion strength after FSP at different traverse speeds was associated with the continuity of the AlCu layer. The electrical conductivity of the Al deposit was remarkably enhanced after FSP due to the disappearance of pores and inter-particle interfaces. Furthermore, the changes in the electrical conductivity of the Al deposit and Al-Cu bimetallic structure after FSP at different traverse speeds were related to the number of grain boundaries and the thickness of IMC layers, respectively.
- Subjects
ELECTRIC conductivity; DISLOCATION density; CRYSTAL grain boundaries; INTERMETALLIC compounds; GRAIN size; ADHESION; SPRAYING
- Publication
Journal of Thermal Spray Technology, 2022, Vol 31, Issue 6, p1813
- ISSN
1059-9630
- Publication type
Article
- DOI
10.1007/s11666-022-01369-1